Silicon wafer plating experiment equipment set
It is a plating device for 2 to 12 inch silicon wafers.
It consists of a special tank and fixtures that take into account the current density distribution and the circulation of the plating solution. By using dedicated fixtures, precise plating for semiconductors and MEMS can be performed. Continuous filtration is carried out while creating gentle convection from the bottom of the tank, and it has an overflow structure, available in a single-side overflow type and a two-side overflow type that allows for high-speed stirring. Paddle stirring is used for direct agitation. With 20 years of experience as a plating device for wafers, we have obtained numerous patents. We also accommodate custom requests starting from a single fixture, so please feel free to contact us.
- Company：山本鍍金試験器
- Price：Other
